The main application direction is high-temperature materials for turbocharger components used in commercial vehicles, passenger cars, agricultural vehicles, gas engines, aircraft engines, etc., which play a role in increasing power, saving energy and reducing emissions.

The main application direction is the carrier of semiconductor integrated circuit chips, realizing reliable electrical connection while requiring controlled expansion precision alloys to ensure dimensional stability and thermal matching performance.

The main application direction is the electromagnetic shielding of semiconductor production equipment and the high-requirement pipes and valve bodies of semiconductor equipment, providing guarantee for the stable operation of equipment, where materials such as nife47 are widely valued for stability.

The main application direction is to provide soft magnetic alloys for shielding to avoid or reduce the interference of magnetic fields on the operation of its equipment, especially materials like 1j85 which offer excellent magnetic permeability.

The main application direction is to seal optical communication sensor devices, provide good sealing support in optical communication sensing, play the role of light transmission in devices, and serve 4G, 5G and big data services.

The main application direction is commercial engines and product parts, where high-performance materials such as corrosion resistant alloy for aerospace companies support long-term safety and durability in harsh environments.

The main application direction is low-voltage power matching and leakage protection.